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Design and simulation of a test pattern for three-dimensional latch-up analysis

JOURNAL ARTICLE published November 1993 in Microelectronics Journal

Authors: Ilaria De Munari | Roberto Menozzi | Fausto Fantini

https://doi.org/10.1016/0026-2692(93)90021-6 Actions

Design and simulation of a test pattern for three-dimensional latch-up analysis

JOURNAL ARTICLE published December 1994 in Microelectronics Reliability

https://doi.org/10.1016/0026-2714(94)90362-x Actions

Ultra-dense: an MCM-based three-dimensional digital signal processor

JOURNAL ARTICLE published October 1993 in Microelectronics Reliability

https://doi.org/10.1016/0026-2714(93)90456-9 Actions

Thermal resistance simulation of IC packages using a three-dimensional boundary element method

JOURNAL ARTICLE published October 1993 in Microelectronics Reliability

https://doi.org/10.1016/0026-2714(93)90426-y Actions

Product Dimensional Metrology and Pattern Defect Inspection

BOOK CHAPTER published 1993 in Microelectronics Manufacturing Diagnostics Handbook

Authors: Henri A. Khoury | Timothy R. Groves | Christian H. Plougonven

https://doi.org/10.1007/978-1-4615-2029-0_5 Actions

Reliability analysis of a three-unit system in a changing environment

JOURNAL ARTICLE published April 1993 in Microelectronics Reliability

Authors: Shibin Song | Yonglu Deng

https://doi.org/10.1016/0026-2714(93)90269-5 Actions

Reliability and M.T.T.F. analysis of a power plant consisting of three generators by Boolean Function technique

JOURNAL ARTICLE published January 1986 in Microelectronics Reliability

Authors: P.P. Gupta | Rakesh Kumar Sharma

https://doi.org/10.1016/0026-2714(86)90008-9 Actions

Analysis of integrated circuits thermal dynamics with point heating time

JOURNAL ARTICLE published January 2011 in Microelectronics Journal

Authors: SŁawomir MikuŁa | Andrzej Kos

https://doi.org/10.1016/j.mejo.2010.09.011 Actions

Analysis of misalignment-induced deformation in three-dimensional semiconductor chip stacks

JOURNAL ARTICLE published 29 April 2014 in Microelectronics International

Authors: Richard W. Johnson | Yu-Lin Shen

https://doi.org/10.1108/mi-12-2013-0085 Actions

A finite element simulator for three-dimensional analysis of interconnect structures

JOURNAL ARTICLE published February 2001 in Microelectronics Journal

Authors: R Sabelka | S Selberherr

https://doi.org/10.1016/s0026-2692(00)00113-0 Actions

Reliability analysis of a three-state multi-component warm standby redundant complex system with waiting for repair

JOURNAL ARTICLE published May 1993 in Microelectronics Reliability

Authors: P.P. Gupta | Shashi Sharma

https://doi.org/10.1016/0026-2714(93)90304-h Actions

Quasi-three-dimensional spice-based simulation of the transient behavior, including plasma spread, of thyristors and over-voltage protectors

JOURNAL ARTICLE published January 2002 in Microelectronics Reliability

Authors: Rodolfo Quintero | Antonio Cerdeira | Adelmo Ortı́z-Conde

https://doi.org/10.1016/s0026-2714(01)00131-7 Actions

Polysilphenylenesiloxane Resist with Three-Dimensional Structure

BOOK CHAPTER published 23 November 1993 in ACS Symposium Series

Authors: K. Watanabe | E. Yano | T. Namiki | Y. Yoneda

https://doi.org/10.1021/bk-1994-0537.ch013 Actions

Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs

JOURNAL ARTICLE published November 2023 in Microelectronics Journal

Research funded by Department of Science and Technology, Ministry of Science and Technology, India (CRG/2021/000780/ES)

Authors: Ajay Kumar | Rohit Dhiman

https://doi.org/10.1016/j.mejo.2023.105941 Actions

Three-dimensional analysis for multilayer wiring in sub-half-micron devices

JOURNAL ARTICLE published October 1997 in Microelectronics Reliability

Authors: Naofumi Murata | Yukinori Hirose | Kazuyoshi Maekawa | Masahiko Ikeno | Hiroshi Koyama

https://doi.org/10.1016/s0026-2714(97)00123-6 Actions

Investigations of short-circuit failure in double trench SiC MOSFETs through three-dimensional electro-thermal-mechanical stress analysis

JOURNAL ARTICLE published July 2021 in Microelectronics Reliability

Authors: Kailun Yao | Hiroshi Yano | Noriyuki Iwamuro

https://doi.org/10.1016/j.microrel.2021.114163 Actions

A two-dimensional semi-analytical analysis of the subthreshold-swing behavior including free carriers and interfacial traps effects for nanoscale double-gate MOSFETs

JOURNAL ARTICLE published December 2011 in Microelectronics Journal

Authors: F. Djeffal | T. Bendib | M.A. Abdi

https://doi.org/10.1016/j.mejo.2011.09.008 Actions

Analysis for effects of mask defects to resist pattern using a three-dimensional photolithography simulator

JOURNAL ARTICLE published 1 September 1990 in Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena

Authors: Tetsuo Ito | Kazuya Kadota | Masaki Nagao | Aritoshi Sugimoto | Masahiro Nozaki | Takeshi Kato

https://doi.org/10.1116/1.584920 Actions

Three Dimensional CFD Conjugate Analysis of Two Inline PLCC Packages Horizontally Mounted

JOURNAL ARTICLE published 1 October 2004 in Journal of Microelectronics and Electronic Packaging

Authors: B. Jayakumar | G. A. Quadir | M. Z. Abdullah | K. N. Seetharamu

https://doi.org/10.4071/1551-4897-1.4.244 Actions

Three-dimensional time-resolved analysis for the discharge of plasma display panel using the scanned-point detecting system

JOURNAL ARTICLE published 1 March 2005 in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

Authors: Hoon-Young Choi | Seok-Hyun Lee | Seung-Gol Lee | Jeong-Hyun Seo

https://doi.org/10.1116/1.1861043 Actions
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